PCIe Gen6 • 112G PAM4 • Sub-Nanosecond RTL

Ultra-Low Latency Silicon & Infrastructure Engineering

We architect mission-critical hardware: custom FPGA IP cores, high-density HDI printed circuit boards, and liquid-cooled datacenter compute fabrics for HFT, AI, and defense.

< 5ns
FPGA Tick-To-Trade
112 Gbps
PAM4 SerDes Tuning
120 kW+
Liquid Rack Density
SILICON_STATUS: OPTIMAL REV_3.2
CHIP_TEMP
42.4 °C
EYE_MARGIN
88.2 %
FPGA RTL
Core Specializations

End-to-End Hardware Consulting Services

FPGA Acceleration & RTL

Sub-microsecond execution logic, custom PCIe Gen 5/6 DMA controllers, direct Ethernet MAC/UDP stack bypass, and AI inference engines.

SystemVerilog Vivado / Quartus AMD UltraScale+ Intel Agilex

High-Speed PCB Design & SI/PI

Ultra-dense 32+ layer HDI stackups, 112G PAM4 channel routing, Ansys HFSS signal integrity simulations, and DDR5 layout verification.

32+ Layers Ansys HFSS Altium / Allegro 112G PAM4

Data Centre Infrastructure

Megawatt density planning, direct-to-chip liquid cooling integration, 100kW+ immersion racks, and N+1 power redundancy architecture.

Liquid Immersion OCP Standards PUE < 1.15 Power Delivery
Domain Expertise

Filterable Technical Capabilities Matrix

[FPGA] PCIe Gen5 / Gen6 Controller Core
[PCB] 112G PAM4 SerDes Signal Integrity Analysis
[DC] Direct-To-Chip Cold Plate Liquid Cooling
[FPGA] SystemVerilog & VHDL Synthesis
[PCB] Ansys HFSS & Keysight ADS Simulation
[DC] Open Compute Project (OCP) ORv3 Rack Design
Real-Time Financial Modeling

Hardware Efficiency & ROI Calculator

150 Servers
500 M/day
350 ns
$0.18 / kWh
ESTIMATED ANNUAL ENERGY SAVINGS
$46,515 / yr
CUMULATIVE DAILY TIME SAVED
175.0 ms/day
RACK DENSITY GAIN RATIO
3.2x
Request Detailed System Spec
Track Record

Featured Technical Implementations

FPGA RTL DEVELOPMENT

Tick-To-Trade Low Latency Execution Engine

Engineered a custom AMD UltraScale+ FPGA pipeline for high-frequency trading. Bypassed Linux kernel networking completely with a direct zero-copy 100G MAC/UDP IP core.

  • Achieved 78ns wire-to-wire processing latency
  • Zero dropped packets under 100% burst network load
// SYNTHESIS RESULTS
Worst Negative Slack (WNS): +0.210ns
Total Negative Slack (TNS): 0.000ns
Clock Frequency: 450.00 MHz
Power Draw: 24.5 Watts
PCB SIGNAL INTEGRITY

32-Layer PCIe Gen 5 Server Board

Designed multi-CPU motherboard substrate handling 112G PAM4 lines using Megtron 7 material and staggered microvias.

  • BER better than 1E-15 across all lanes
  • First-spin fabrication success with zero board revisions
// HFSS EYE DIAGRAM METRICS
Eye Height: 118 mV
Eye Width: 0.65 UI
Stackup: 32 Layers Rigid-Flex
Impedance Tolerance: ±5%
DATA CENTRE FACILITY

2MW Immersion Cooling Infrastructure Migration

Retrofitted high-density AI compute facility to dielectric fluid immersion tanks, drastically improving energy efficiency.

  • Reduced facility PUE from 1.62 down to 1.07
  • Supported up to 100kW per individual rack tank
// THERMAL PERFORMANCE
Max GPU Temp: 64°C @ 100% Load
Cooling OPEX Cut: -58%
Fluid: Synthetic Dielectric
Standards: OCP Compliant
Engage Engineering

Initiate NDA & Project Scoping

Directly consult with principal hardware architects. Initial reviews covered under mutual NDA prior to engineering schematic access.

Strict Mutual NDA
IP protection guaranteed before disclosure.
Fast Turnaround
Technical review response within 4 hours.

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